1
Number of floors
14L
2
Plate thickness
2.6mm
3
Material
TU-862HF
4
Surface treatment
OSP+gold deposit
5
Minimum line width/line spacing
75/75μm
6
Minimum hole diameter
0.25mm
7
Special processes
1. Design of male and female copper of core layer
2. Plasma process
3. Aspect ratio 10.4:1